Ole 3rd Generation Semiconductor Forum 2022 ole a faia i Suzhou ile Tesema 28th!
Semiconductor CMP Materialsma Targets Symposium 2022 o le a faia i Suzhou ia Tesema 29th!
E tusa ai ma le upega tafaʻilagi aloaia a McLaren, na latou faʻaopoopo talu ai nei se tagata faʻatau OEM, le American hybrid sports car brand Czinger, ma o le a tuʻuina atu le isi augatupulaga IPG5 800V silicon carbide inverter mo le tagata faʻatau 21C supercar, lea e faʻamoemoe e amata faʻatau atu i le tausaga a sau.
E tusa ai ma le lipoti, o le Czinger hybrid taʻaloga taʻavale 21C o le a faʻapipiʻiina i le tolu IPG5 inverters, ma o le maualuga o le gaosiga o le a oʻo atu i le 1250 horsepower (932 kW).
O le mamafa e itiiti ifo i le 1,500 kilokalama, o le taʻavale taʻavale o le a faʻapipiʻiina i le 2.9-lita twin-turbocharged V8 afi e faʻasolosolo i luga o le 11,000 rpm ma faʻavave mai le 0 i le 250 mph i le 27 sekone, faʻaopoopo i le eletise eletise carbide silicon.
I le aso 7 o Tesema, na faʻasalalau ai e le upega tafaʻilagi aloaia a Dana ua latou sainia se maliega tuʻufaʻatasia mo se taimi umi ma SEMIKRON Danfoss e faʻamautu ai le gaosiga gafatia o semiconductor carbide silicon.
Ua lipotia mai o Dana o le a faʻaaogaina le SEMIKRON's eMPack silicon carbide module ma ua faʻatupuina le lalaga ma le maualuga eletise eletise.
I le aso 18 o Fepuari i le tausaga nei, na fai mai ai le upega tafaʻilagi aloaia a SEMIKRON na latou sainia se konekarate ma se kamupani Siamani mo le 10+ piliona euros (sili atu i le 10 piliona yuan) silicon carbide inverter.
SEMIKRON na faʻavaeina i le 1951 e avea o se Siamani gaosi oloa eletise ma faiga.O loʻo lipotia mai o le taimi lea na faʻatonuina ai e le kamupani taʻavale Siamani le eMPack® fou a le SEMIKRON.O le eMPack® power module platform ua sili ona lelei mo tekinolosi carbide silicon ma faʻaoga atoatoa le faʻaogaina o le "direct pressure mold" (DPD), faʻatasi ai ma le gaosiga o le voluma fuafuaina e amata i le 2025.
Dana Tuufaatasio se kamupani taʻavale a Amerika Tier1 na faʻavaeina i le 1904 ma faʻauluulu i Maumee, Ohio, ma faʻatau atu e $8.9 piliona i le 2021.
I le aso 9 o Tesema, 2019, na tuʻuina atu ai e Dana lona SiC inverterTM4, lea e mafai ona tuʻuina atu le sili atu i le 800 volts mo taavale pasese ma le 900 volts mo taʻavale taʻavale.E le gata i lea, o le inverter o loʻo i ai le malosi malosi o le 195 kilowatts i le lita, toetoe a faaluaina le US Department of Energy's 2025 target.
E tusa ai ma le sainia, fai mai Dana CTO Christophe Dominiak: O loʻo faʻatuputeleina le matou polokalame faʻaeletise, o loʻo i ai se matou faʻatonuga tele ($350 miliona i le 2021), ma e taua tele le faʻaliliuina.O lenei maliliega faʻatauga e tele tausaga ma Semichondanfoss e maua ai e i matou se avanoa faʻapitoa e ala i le faʻamautinoaina o avanoa i SIC semiconductors.
I le avea ai ma mea autu o atinaʻe faʻapitoa e tulaʻi mai e pei o fesoʻotaʻiga o loʻo sosoo mai, taavale malosi fou, ma nofoaafi televave, o le semiconductor o augatupulaga lona tolu o loʻo faʻatusalia e le silicon carbide ma le gallium nitride o loʻo lisiina o ni manatu autu i le "14th Five-Year Plan. ” ma le otootoga o sini umi mo le 2035.
Silicon carbide 6-inisi le gaosiga o le gaosiga o loʻo i ai i se vaitau o le faʻalauteleina vave, aʻo taʻitaʻia tagata gaosi oloa o loʻo faʻatusalia e Wolfspeed ma STMicroelectronics ua ausia le gaosiga o 8-inisi silicon carbide wafers.O fale gaosi oloa e pei o Sanan, Shandong Tianyue, Tianke Heda ma isi gaosi oloa e masani ona taulaʻi i 6-inisi wafers, faʻatasi ai ma le sili atu i le 20 galuega faʻatatau ma se tupe teufaafaigaluega e sili atu i le 30 piliona yuan;O lo'o fa'apena fo'i fa'agasologa o fa'atekonolosi wafer 8-inisi i totonu o le atunu'u.Faʻafetai i le atinaʻeina o taʻavale eletise ma faʻapipiʻiina mea tetele, o le faʻatupulaia o maketi o masini carbide silicon e faʻamoemoe e oʻo atu i le 30% i le va o le 2022 ma le 2025. O le a tumau pea le faʻaogaina o mea e faʻatapulaʻaina ai le malosi mo masini carbide silicon i tausaga a sau.
O masini GaN o loʻo faʻauluina i le taimi nei e le maketi o le eletise vave ma le 5G macro base station ma le millimeter wave small cell RF maketi.O le maketi GaN RF e masani ona nofoia e Macom, Intel, ma isi, ma o le maketi eletise e aofia ai Infineon, Transphorm ma isi.I tausaga talu ai nei, o pisinisi i totonu o le atunuʻu e pei o Sanan, Innosec, Haiwei Huaxin, ma isi o loʻo faʻagaoioia foʻi galuega faatino gallium nitride.E le gata i lea, ua vave ona atiaʻe masini laser gallium nitride.GaN semiconductor lasers o loʻo faʻaaogaina i lithography, teuina, militeri, fomaʻi ma isi fanua, faʻatasi ai ma faʻasalalauga faʻaletausaga e tusa ma le 300 miliona iunite ma le fua faatatau o le tuputupu aʻe lata mai o le 20%, ma le aofaʻi o maketi e faʻamoemoe e oʻo atu i le $ 1.5 piliona i le 2026.
O le 3rd Generation Semiconductor Forum o le a faia ia Tesema 28, 2022. O le tele o atinaʻe taʻutaʻua i totonu ma fafo na auai i le fonotaga, e taulaʻi atu i luga ma lalo o filifili pisinisi o le silicon carbide ma gallium nitride;Le substrate sili ona lata mai, epitaxy, masini gaosi tekinolosi ma gaosiga tekinolosi;O le alualu i luma o suʻesuʻega o tekinolosi faʻaonaponei o semiconductors lautele e pei o le gallium oxide, alumini nitride, taimane, ma le zinc oxide o loʻo faʻamoemoeina.
Le mataupu o le fono
1. O le a'afiaga o le fa'asa a le US chip i le atina'eina o semiconductor a tupulaga lona tolu a Saina
2. Global ma Saina lona tolu-tupulaga semiconductor maketi ma alamanuia tulaga atinae
3. Sapalai ma le mana'oga o le wafer ma le tolu-tupulaga semiconductor avanoa maketi
4. Tupe fa'afaigaluega ma maketi mana'omia va'aiga mo poloketi SiC 6-inisi
5. Tulaga quo ma le atina'eina o SiC PVT tuputupu a'e tekinolosi & auala vai vaega
6. 8-inisi SiC localization faagasologa ma faatekinolosi manuia
7. SiC maketi ma tekinolosi atinae faafitauli & fofo
8. Faʻaaogaina o masini GaN RF ma modules i nofoaga autu 5G
9. Atinaʻe ma suia le GaN i le maketi vave faʻatau
10. GaN masini masini masini ma maketi talosaga
11. Avanoa ma lu'itau mo localization ma tekinolosi ma meafaigaluega atinae
12. O isi fa'amoemoega tau atina'e semiconductor o augatupulaga lona tolu
Faila fa'ainisinia(CMP) o se faiga autu mo le ausiaina o le wafer flatteing lalolagi.Ole fa'agasologa ole CMP e fa'agasolo ile gaosiga o fa'ama'i sikoni, gaosiga fa'atasi, afifiina ma su'ega.O le sua fa'alelei ma le pa'u fa'alelei o mea'ai autu ia o le CMP process, fa'amauina mo le sili atu i le 80% o le maketi o meafaitino CMP.CMP meafaitino ma meafaigaluega atinaʻe o loʻo faʻatusalia e Dinglong Co., Ltd. ma Huahai Qingke ua maua le gauai totoʻa mai le alamanuia.
O mea faʻatatau o le autu autu lea mo le saunia o ata tifaga, lea e masani ona faʻaaogaina i semiconductors, panels, photovoltaics ma isi faʻalapotopotoga e ausia ai galuega faʻamalosi poʻo poloka.I totonu o mea tetele semiconductor, o mea fa'atatau e sili ona gaosia i totonu o le atunu'u.Aluminium fale, kopa, molybdenum ma isi mea faʻatatau ua faia faʻalavelave, o kamupani lisi autu e aofia ai Jiangfeng Electronics, Youyan New Materials, Ashitron, Longhua Technology ma isi.
O le isi tolu tausaga o le a avea ma se vaitau o le televave o le atinaʻeina o pisinisi gaosi semiconductor a Saina, SMIC, Huahong Hongli, Changjiang Storage, Changxin Storage, Silan Micro ma isi atinaʻe e faʻavavevave ai le faʻalauteleina o le gaosiga, Gekewei, Dingtai Craftsman, China Resources Micro ma isi. atina'e fa'atulagaina o 12-inisi laina gaosiga o le a tu'uina foi i le gaosiga, lea o le a aumaia ai le mana'oga tele mo mea CMP ma mea fa'atatau.
I lalo o le tulaga fou, o le saogalemu o le faʻatau oloa faʻalotoifale ua amata ona sili atu ona taua, ma e taua tele le faʻaleleia o mea faʻatau oloa i le lotoifale, lea o le a aumaia ai foi le tele o avanoa i le au faʻatau fale.O le manuia o le poto masani o mea fa'atatau o le a maua ai fo'i fa'amatalaga mo le atina'eina o isi mea.
O le Semiconductor CMP Materials and Targets Symposium 2022 o le a faia i Suzhou ia Tesema 29. O le fonotaga na talimalo ai Asiacchem Consulting, faatasi ai ma le auai o le tele o pisinisi i totonu ma fafo.
Le mataupu o le fono
1. O meafaitino CMP a Saina ma faiga fa'avae fa'atatau ma faiga tau maketi
2. Le a'afiaga o fa'asalaga a le US i luga o le fa'asoaina o meafaitino semiconductor i totonu o le atunu'u
3. CMP meafaitino ma maketi taula'i ma au'ili'iliga tau atina'e
4. Semiconductor CMP polishing slurry
5. CMP polesi pad ma faamama vai
6. Alualu i luma o meafaigaluega faʻapolopolo CMP
7. Semiconductor taula'i maketi tu'uina atu ma mana'oga
8. Fa'asologa o atina'e autu o le semiconductor
9. Alualu i luma i le CMP ma fa'aoga tekonolosi
10. Aafiaga ma fa'asinomaga o le fa'aogaina o mea fa'atatau
Taimi meli: Ian-03-2023