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XCZU19EG-2FFVC1760E 100% Fou & Original DC To DC Su'e & Suiga Pule Fa'atonu Chip

fa'amatalaga puupuu:

O lenei aiga o oloa o loʻo tuʻufaʻatasia le faʻaogaina o le 64-bit quad-core poʻo le lua-core Arm® Cortex®-A53 ma le lua-core Arm Cortex-R5F faʻavae faiga faʻavae (PS) ma le logic programmable (PL) UltraScale architecture i se tasi. masini.O lo'o aofia ai fo'i ma mea e manatua i luga ole masini, feso'ota'iga manatua fafo teleport, ma se seti mauoa o feso'ota'iga feso'ota'iga.


Fa'amatalaga Oloa

Faailoga o oloa

Uiga Oloa

Uiga Oloa Uiga Taua
Tufuga: Xilinx
Vaega o oloa: SoC FPGA
Fa'asaina o Va'a: Atonu e mana'omia e lenei oloa ni fa'amaumauga fa'aopoopo e fa'atau atu mai le Iunaite Setete.
RoHS:  Fa'amatalaga
Tulaga fa'apipi'i: SMD/SMT
Paket/Mata: FBGA-1760
Autu: ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2
Numera o Core: 7 Autu
Maualuluga o le Uati Faatele: 600 MHz, 667 MHz, 1.5 GHz
L1 Cache Fa'atonuga Manatu: 2 x 32 kB, 4 x 32 kB
L1 Cache Fa'amaumauga Fa'amaumauga: 2 x 32 kB, 4 x 32 kB
Tele o mea e manatua polokalame: -
Fa'amatalaga RAM Tele: -
Numera o Vaega Fa'atatau: 1143450 LE
Adaptive Logic Modules - ALM: 65340 ALM
Manatu Fa'amau: 34.6 Mbit
Galue Sapalai Galue: 850 mV
La'ititi ole Vevela ole Gaioiina: 0C
Maualuluga Fa'agaioiga Vevela: + 100 C
Fa'ailoga: Xilinx
RAM tufaina: 9.8 Mbit
poloka fa'apipi'i RAM - EBR: 34.6 Mbit
Susū ma'ale'ale: Ioe
Numera o Poloka Fa'atonu - LAB: 65340 LAB
Numera o Transceiver: 72 Faaliliuina
Ituaiga oloa: SoC FPGA
Fa'asologa: XCZU19EG
Aofaiga o pusa falegaosimea: 1
Vaega laiti: SOC - Faiga i luga ole Chip
igoa Fefa'ataua'iga: Zynq UltraScale+

Ituaiga Circuit Integrated

Pe a faatusatusa i electrons, photons e leai se tele static, fegalegaleaiga vaivai, malosi anti-faalavelave faʻalavelave, ma e sili atu ona talafeagai mo faʻamatalaga tuʻuina atu.O feso'ota'iga fa'apitoa e fa'amoemoe e avea ma tekonolosi autu e malepe ai le puipui o le eletise, puipui puipui ma puipui feso'ota'iga.Iluminant, coupler, modulator, waveguide masini e tuʻufaʻatasia i totonu o foliga mataʻutia maualuga e pei o le photoelectric integrated micro system, e mafai ona iloa le lelei, voluma, faʻaogaina o le eletise o le maualuga o le faʻaogaina o le photoelectric, faʻapipiʻi faʻapipiʻi ata e aofia ai le III - V compound semiconductor monolithic integrated (INP). ) tu'ufa'atasiga tu'ufa'atasiga, silicate po'o tioata (planar optical waveguide, PLC) fa'avae ma fa'avae fa'avae.

InP platform e masani ona faʻaaogaina mo le gaosiga o le laser, modulator, detector ma isi masini faʻagaioiga, tulaga maualalo tekinolosi, maualuga substrate tau;Faʻaaogaina o le PLC faʻavae e maua ai vaega passive, maualalo maualalo, voluma tele;O le fa'afitauli tele i fa'avae uma e lua o mea e le fetaui ma mea fa'aeletonika fa'avae silicon.O le mea sili ona lauiloa o le faʻaogaina o le photonic e faʻatatau i le silicon o le faʻagasologa e fetaui ma le CMOS process ma o le tau o le gaosiga e maualalo, o lea e manatu ai o le optoelectronic sili ona mafai ma e oʻo lava i mea uma-optical integration scheme.

E lua auala tu'ufa'atasia mo masini fa'ata'ita'i fa'atusa ma le CMOS.

O le lelei o le muamua o le photonic masini ma masini faaeletonika e mafai ona optimized eseese, ae o le afifiina mulimuli ane e faigata ma talosaga faapisinisi e faatapulaaina.O le mea mulimuli e faigata ona mamanuina ma faʻagasolo le tuʻufaʻatasia o masini e lua.I le taimi nei, o le fa'apotopotoga hybrid e fa'avae i luga o le tu'ufa'atasiga faaniukilia o le filifiliga sili lea


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