Fa'aeletonika ic chip Lagolago BOM Auaunaga TPS54560BDDAR fou ic chips vaega fa'aeletonika
Uiga Oloa
| ITIGA | FAAMATALAGA |
| Vaega | Vaega Fa'atasi (ICs) |
| Mfr | Texas Meafaigaluega |
| Fa'asologa | Eco-Mode™ |
| afifi | Tape & Reel (TR) Tipi tipi (CT) Digi-Reel® |
| SPQ | 2500T&R |
| Tulaga Oloa | Malosi |
| Galuega | Laa-Ilalo |
| Fa'asologa o Fa'asologa | Lelei |
| Topology | Buck, Vaevae nofoaafi |
| Ituaiga Galuega | Fa'atonu |
| Numera o Galuega Fa'atino | 1 |
| Malosi - Ulufale (Min) | 4.5V |
| Malosi - Ulufale (Max) | 60V |
| Malosi - Gao'o (Min/Fa'amau) | 0.8V |
| Malosi - Gao'o (Max) | 58.8V |
| O lo'o iai - Fa'asologa | 5A |
| Fa'atele - Suiga | 500kHz |
| Fa'asa'o Fa'atasi | No |
| Galulue Vevela | -40°C ~ 150°C (TJ) |
| Ituaiga Fa'amau | Mauga i luga |
| Paketi / Pusa | 8-PowerSOIC (0.154", 3.90mm Lautele) |
| Fa'atau Mea Fa'atau Mea | 8-SO PowerPad |
| Numera Oloa Fa'avae | TPS54560 |
1.Fa'aigoaina o le IC, afifi malamalama lautele ma tulafono fa'aigoaina:
Va'aiga vevela.
C=0°C i le 60°C (vaega faapisinisi);I=-20°C i le 85°C (vasega tau pisinisi);E=-40°C i le 85°C (fa'ateleina tulaga tau alamanuia);A=-40°C i le 82°C (vaega vateatea);M=-55°C i le 125°C (vaega militeri)
Ituaiga afifi.
A-SSOP;B-CERQUAD;C-TO-200, TQFP;D-Ceramic apamemea pito i luga;E-QSOP;F-Ceramic SOP;H- SBGAJ-Ceramic DIP;K-TO-3;L-LCC, M-MQFP;N-VITIPITI;N-DIP;Q PLCC;R - Vaiti Ceramic DIP (300mil);S - TO-52, T - TO5, TO-99, TO-100;U - TSSOP, uMAX, SOT;W - Fa'ailoga Laiti Laiti Lautele (300mil) W-Fa'amea la'ititi la'ititi (300mili);X-SC-60 (3P, 5P, 6P);Y-Laiti apamemea pito i luga;Z-TO-92, MQUAD;D-Oti;/ PR-Fa'amalosia palasitika;/W-Wafer.
Numera o pine:
a-8;e-10;c-12, 192;o-14;e-16;f-22, 256;g-4;h-4;i -4;H-4;I-28;J-2;K-5, 68;L-40;M-6, 48;N 18;O-42;P-20;Q-2, 100;R-3, 843;S-4, 80;T-6, 160;U-60 -6,160;U-60;V-8 (taamilosaga);W-10 (taamilosaga);X-36;Y-8 (taamilosaga);Z-10 (taamilosaga).(taamilosaga).
Manatua: O le mataitusi muamua o le suffix mataitusi e fa o le vasega faʻaoga o le E, o lona uiga o le masini o loʻo i ai le galuega antistatic.
2.Atinae o tekinolosi afifi
O taʻaloga faʻapipiʻi muamua na faʻaaogaina pusa mafolafola sima, lea na faʻaauau pea ona faʻaaogaina e le militeri mo le tele o tausaga ona o lo latou faʻamaoni ma laʻititi laʻititi.E le'i umi ae suia le afifiina o le matagaluega i ni afifi i laina lua, amata i le sima ona sosoo ai lea ma le palasitika, ma i le vaitau o le 1980 o le numera o pine o le VLSI na sili atu nai lo tapulaa o le talosaga o pusa DIP, ma iu ai ina tula'i mai le pine grid arrays ma le uta va'a.
Na aliaʻe le afifi i luga o le mauga i le amataga o le 1980s ma na lauiloa i le vaega mulimuli o lena sefulu tausaga.E fa'aaogaina se pine pine e sili atu ona lelei ma e iai lona apa'au gull po'o le J-foliga pine pine.O le Small-Outline Integrated Circuit (SOIC), mo se faʻataʻitaʻiga, e 30-50% le itiiti o le eria ma e 70% itiiti ifo le mafiafia nai lo le DIP tutusa.O lenei afifi o loʻo i ai pine faʻapipiʻi-apaʻau o loʻo faʻaoso mai i itu umi e lua ma se pine pitch o le 0.05".
Laiti-Outline Integrated Circuit (SOIC) ma pusa PLCC.i le 1990s, e ui lava o le pusa PGA sa masani ona faʻaaogaina mo microprocessors maualuga.o le PQFP ma le afifi laiti-outline manifinifi (TSOP) na avea ma afifi masani mo masini numera maualuga pine.Intel ma AMD's high-end microprocessors siitia mai PGA (Pine Grid Array) afifi i Land Grid Array (LGA) afifi.
Ball Grid Array afifi na amata ona aliali mai i le 1970s, ma i le 1990s na fausia ai le FCBGA package ma le maualuga o pine nai lo isi afifi.I totonu o le pusa FCBGA, o le paʻu o loʻo faʻafefe i luga ma lalo ma faʻafesoʻotaʻi i polo solder i luga o le afifi e se PCB-pei o le faavae faʻavae nai lo uaea.I le maketi i aso nei, o le afifiina foi ua avea nei ma vaega eseese o le faagasologa, ma o tekinolosi o le afifi e mafai foi ona aafia ai le lelei ma le fua o le oloa.
